Cheap YCIA SPI 3D Manufacturer, Exporter

YCIA is used to monitor and inspect the quality of solder paste printing. As electronic products become increasingly sophisticated and surface-mount components grow smaller, the standards for solder paste printing quality are also rising. YCIA effectively ensures printing quality, improves print quality, reduces product defect rates, saves on labor costs, and boosts production efficiency.

Product Description

Technical Specifications

Category Parameter Details
Inspection System Camera Resolution 5 Mega Pixels
Inspection System Lighting Surrounding RGB Light Source
Inspection System Max Inspection Height 450μm
Software Operating System Windows 10 Ultimate 64bit
Software Programming Gerber/CAD Import, Offline & Manual
Mechanical PCB Size Min: 50x50mm | Max: 510x700mm

Key Features

High-speed Operation High speed operation

Features an industrial CCD camera with ultra-low distortion and unique parallel light design for clear imaging of tall components.

3D Lenticular Projection 3D Projection

Utilizes a five-step phase-shifting algorithm to ensure shadow-free detection with 1μm accuracy.

Warpage Compensation Warpage Compensation

Provides real-time measurement and compensation for PCB warpage to maintain high precision measurement data.

Frequently Asked Questions

1. What is the camera resolution of the YCIA system? The system is equipped with a 5 Mega Pixel high-speed CCD camera.
2. Does the system support offline programming? Yes, it supports Gerber and CAD import for both offline and manual programming.
3. What is the maximum size of PCB it can inspect? The maximum supported PCB size is 510mm x 700mm.
4. Is the system compatible with standard production lines? Yes, it complies with SMEMA standards and features an automatic width adjustment system.
5. How accurate is the 3D detection? The system achieves a height detection accuracy of up to 1μm.
6. What operating system does the software require? The system operates on Windows 10 Ultimate 64bit.

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