Yichun Electronic
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| Model | YC-H300AF |
| Dimensions (L×W×H) | 4300x1250x1650mm |
| Weight | Approx. 1300 kg |
| Solder Pot Capacity | Lead-free 300 kg |
| Power Supply | 380V, 50/60Hz, 3-Phase 5-Wire |
| Control System | PC + PLC |
| Preheating Zone | 3 |
| Preheating Temperature | Room Temperature – 250°C |
The solder pot is constructed with a titanium alloy inner liner and nozzle, providing excellent corrosion resistance. Optimized wave structure reduces tin slag oxidation, while the automatic surface-cleaning mechanism ensures solder purity.
High-precision spray nozzles with adjustable width (20–55mm) and height (50–180mm). Atomized spray ensures uniform coating and reduced waste.
The system supports a 300 kg lead-free solder pot capacity.
Yes, it supports PCB widths ranging from 50mm to 300mm.
The equipment uses a reliable integrated PC + PLC control system.
The machine is equipped with 3 independent preheating zones.
Yes, it supports temperature adjustment from room temperature up to 250°C.
It requires a 380V, 50/60Hz, 3-Phase 5-Wire power supply.
