| Model | YC-350N | YC-450N |
|---|---|---|
| Dimensions (L x W x H) | 4450 × 1450 × 1700 mm | 4450 × 1550 × 1700 mm |
| Weight | Approx. 1300 kg | Approx. 1500 kg |
| Solder Pot Capacity | Lead-free: 380 kg | Lead-free: 500 kg |
| Control System | PC + PLC | PC + PLC |
| Power Supply | Three-phase, 380 V/50 Hz | Three-phase, 380 V/50 Hz |
| Preheating Method | Full Hot-Air Preheating | Full Hot-Air Preheating |
| PCB Width | 50–350 mm | 50–450 mm |
Maintains oxygen concentration at ≤800 ppm, reducing tin oxidation, minimizing solder dross, and improving joint reliability.

Equipped with an external chiller for rapid cooling, minimizing thermal shock and ensuring high-quality lead-free soldering.

It reduces oxygen levels to prevent tin oxidation, ensuring higher quality solder joints.
Suitable for SMT assembly, DIP insertion, and mixed-technology PCB production.
Yes, it features a user-friendly Siemens PLC + industrial PC interface with parameter storage.
It enables rapid cooling to protect components from excessive thermal stress.
Yes, the system allows saving multiple production recipes for efficient switching.
The system includes an automatic solder pot loading/unloading design for easy cleaning and maintenance.