1 / 2
| Item | Specification |
| Model | YC-H800AF |
| Dimensions (L×W×H) | 5350 × 1350 × 1550 mm |
| Weight | Approx. 1800 kg |
| Heating Zones Length | Approx. 3200 mm |
| Heating Zones | 8 Zones (Top & Bottom Heating) |
| Cooling Zones | 2 or 3 Zones |
| Power Supply | 380V, 50/60Hz, 3-Phase 5-Wire |
| Total Power | 48 kW |
| Normal Power Consumption | Approx. 13 kW |

Provides a low-oxygen soldering environment to improve solder joint quality.
Heavy-duty structure for stable transportation of larger or heavier PCBs.
Enhances cooling efficiency in high-volume production environments.


| Product Name | Purpose |
| Loader | Automatically loads PCBs |
| Solder Paste Printer | Prints solder paste |
| 8-Zone Reflow Oven | Solders components |
| Inline AOI | Defect detection |
| NG/OK Unloader | Sorts PCBs |


