Famous China Fully Automatic Solder Paste Dispenser - Top Suppliers and Factory for SMT Production Lines Manufacturer, Manufacturers

Introducing our state-of-the-art solder paste applicator designed specifically for SMT production lines in China. This machine from our trusted suppliers provides precise application of solder paste on PCBs, ensuring optimal performance and quality. Equipped with efficient rail transport and anti-warping fixtures, it guarantees high-precision control for consistent print quality across various substrate sizes. As a leading factory in electronics manufacturing, we cater to a wide range of applications, enhancing production yield and maintaining process stability. Experience the difference with our innovative solutions tailored for the electronics industry

Product Description

IS-GP Technical Specification
Category Parameter Specification (IS-GP)
Wire MeshScreen Mesh Size550x500mm / 736x736mm
Printing OriginCenter
SubstrateSize (Min-Max)50x50mm - 350x300mm
Thickness0.4-6.0mm
WeightMax 1.0 kg
Transfer TrackWorking Height920±30mm
Track System3 sections / Ring Belts
Clamping MethodEdge/Vacuum/Anti-Warping
Cycle Time7.0 S (Basic) / <10min (Changeover)
AccuracyCalibration ±12.5 um
Voltage1⌀ 200-230V, 50/60Hz, <2.0 KVA
Dimensions1468 x 1344 x 1544mm
Frequently Asked Questions
What is the maximum substrate size supported?
The IS-GP supports substrates up to 350x300mm with a maximum weight of 1.0 kg.
How fast is the basic printing cycle?
The machine is capable of a high-efficiency basic printing cycle time of 7.0 seconds.
Is the product changeover process quick?
Yes, the system is engineered for efficiency, allowing changeovers in under 10 minutes.
What clamping options are provided?
It includes Edge Clamps, Vacuum Clamps, and Anti-Warping Clamps for precise positioning.
What are the power and air requirements?
It requires 1⌀ 200-230 VAC power and 5-6 bars of air pressure (up to 150 L/min).

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