Yichun Electronic
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| Model | YC-H300AF |
| Dimensions (L×W×H) | 4300x1250x1650mm |
| Weight | Approx. 1300 kg |
| Solder Pot Capacity | Lead-free 300 kg |
| Power Supply | 380V, 50/60Hz, 3-Phase 5-Wire |
| Control System | PC + PLC |
| Preheating Zone | 3 |
| Preheating Length | 1700 mm |
| Preheating Temperature | Room Temperature – 250°C |
| PCB Width | 50 – 300 mm |
| Startup Power | Approx. 18 kW |
| Operation Power | Approx. 7 kW |
The solder pot is constructed with a titanium alloy inner liner and nozzle, providing excellent corrosion resistance and long service life. Optimized wave structure design reduces tin slag oxidation. High-temperature resistant drive motors ensure stable wave peaks, and the automatic surface-cleaning mechanism maintains solder purity.
Equipped with high-precision spray nozzles, the flux system offers adjustable spray width from 20–55mm and nozzle height from 50–180mm. The atomized spray ensures uniform coating and controlled flux consumption.
