Yichun Electronic
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| Model | YC-H350AF | YC-H450AF |
| Dimensions (L×W×H) | 4300×1350×1700mm | 4600×1350×1700mm |
| Weight | Approx. 1500 kg | Approx. 1800 kg |
| Solder Pot Capacity | Lead-free 380 kg | Lead-free 450 kg |
| Power Supply | 380V, 50/60Hz, 3-Phase | 380V, 50/60Hz, 3-Phase |
| Control System | PC + PLC | PC + PLC |
| Preheating Zones | 3 | 3 |
| PCB Width | 50 – 350 mm | 50 – 450 mm |
Titanium alloy furnace chamber and claws ensure high-temperature resistance and minimal oxidation slag.
Siemens PLC integrated with PC control for real-time parameter monitoring and adjustment.
Stepping motor controlled flux nozzle automatically adjusts to PCB width for maximum efficiency.
The models vary primarily in solder pot size and PCB processing capacity, with the 450AF supporting wider boards.
Yes, all components including the furnace are designed specifically for lead-free soldering environments.
The system features 3 independent preheating zones to ensure optimal thermal profiling.
The spray nozzle utilizes a smart stepping motor to match PCB width, preventing over-spraying.
Yes, the furnace supports both manual and electric entry/exit adjustments for operation and safety.
