Yichun Electronic
1 / 5
| Model | YC-H250AF |
| Dimensions (L×W×H) | 42500x1200x1600mm |
| Weight | Approx. 700 kg |
| Solder Pot Capacity | Lead-free 200 kg |
| Power Supply | 380V, 50/60Hz, 3-Phase 5-Wire |
| Control System | PC + PLC |
| Preheating Zone | 2 |
| Preheating Length | 1200 mm |
| Preheating Temperature | Room Temperature – 250°C |
| PCB Width | 50 – 250 mm |
| Startup Power | Approx. 11 kW |
| Operation Power | Approx. 4 kW |
The solder pot features a titanium alloy liner and nozzle for long-lasting durability and corrosion resistance. Lead-free solder oxidation is minimal (approx. 0.6–0.8 kg/8h), and high-temperature motors maintain stable wave peaks. Automatic surface-cleaning ensures consistent solder quality for reliable joints.
The flux system uses precision nozzles with adjustable width 20–50mm and height 50–170mm, delivering up to 50ml/min. It provides uniform, controlled flux application to improve soldering consistency and reduce waste.
Stainless steel heating elements combined with advanced insulation provide stable, efficient preheating. Multi-zone independent PID control ensures rapid, even heating, creating optimal thermal conditions for high-quality soldering.
The conveyor features reinforced chain rails and titanium alloy dual-hook claws for PCBs up to 250mm wide. A synchronized board-feeding device prevents PCB misalignment, with conveyor speed accuracy of ±2mm/min. Optional electric width adjustment is available for flexible production.
