China IPM Fully Automatic Solder Paste Dispenser Manufacturer, Factory

Designed specifically for SMT production lines, this machine delivers precise solder paste application on PCBs. Featuring efficient rail transport, anti-warping fixtures, and high-precision control, it ensures consistent print quality across substrates of various sizes. Suitable for a wide range of electronics manufacturing applications, it helps improve production yield and process stability.

Product Description

Technical Specification

ItemDetail
ModelIS-GP
Screen Mesh Size550x500mm / 736x736mm
Substrate Size50x50mm to 350x300mm
Printing Accuracy±12.5 um
Cycle Time7.0 S
Machine Dimensions1468 x 1344 x 1544 mm

Functions & Features

⚙️ 3-Section Conveyor System

Optimizes PCB movement and reduces total conveyance time efficiently.

🧩 Multi-point Clamping

Specialized edge mechanism ensures maximum stability and superior print quality.

⚡ Motor-Controlled Clamp

Adjustable precision clamping to minimize substrate warping during processing.

Frequently Asked Questions

💡 What is the printing accuracy of this model?
The system provides a high-precision calibration accuracy of ±12.5 um.
💡 What substrate sizes are supported?
It supports substrates ranging from a minimum of 50x50mm up to 350x300mm.
💡 How long does the changeover process take?
The system is designed for efficiency, with changeover times of less than 10 minutes.
💡 What is the power requirement?
The machine operates on 200-230V AC, consuming less than 2.0 KVA.
💡 Does it support vacuum clamping?
Yes, the machine supports Edge Clamps, Vacuum Clamps, and Anti-Warping Clamps.

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